ICPT 2024
ICPT 2024 - Wiesbaden, October 15-18, 2024

ICPT 2024 - International Conference on Planarization/ CMP Technology

The 19th International Conference on Planarization/CMP Technology 2024 - ICPT2024 - will be held in Wiesbaden, Germany. The European CMP User Groups kindly invite you to this amazing health resort city – one of Germany’s hidden champions. Following European venues such as Dresden, Grenoble and Leuven, we are proud to organize the ICPT Conference 2024 again in Europe, and hope that it will be a wonderful event.

Chemical Mechanical Planarization/Polishing (CMP), one of the most important processes in the manufacturing of semiconductor devices, has been developed and improved continuously year after year, it has maintained its position in related industries, and has increased its application areas. From the user’s point of view, technical demand is growing more and more, and fields of application beyond the semiconductor sector are increasing equally.

ICPT as an international symposium for Planarization/CMP offers magnificent opportunities for discussions on technologies including FEOL and BEOL CMP, 3D/TSV, Fundamentals of CMP, Polishing Processes, Consumables, Equipment, Green Devices, New Applications, Metrology, Cleaning, Defect Control, Process Control, CMP Alternatives, SiC, GaN, Sapphire and Diamond. The conference provides a place where researchers and engineers alike meet, discuss and share experiences in their field of knowledge. Enthusiastic presentations and discussions are expected to be on an equal footing, flat like the surface of wafer, no matter from which country or organization presenters come, which position they hold or in which technology area they have gained experience or are experts.

The organizing committee would like the ICPT2024 Conference to offer good opportunities for every attendee to learn something new or expand their networks through discussions or information exchange in the field of CMP.

Welcome to ICPT 2024 in Wiesbaden!

Knut Gottfried, Viorel Balan,
Patrick Ong, Catharina Rudolph,
Eric Jacquinot, Cedric Perrot, Cathérine Euvrard

Committee

Committees

Committee

Executive committee

China
Xinchun Lu, Tsinghua University
Xin-Ping Qu, Fudan University

Europe
Patrick Ong, imec
Knut Gottfried, Fraunhofer ENAS

Japan
Syuhei Kurokawa, Kyushu University
Yukiteru Matsui, KIOXIA Corp.

South Korea
Jingoo Park, Hanyang University
Taesung Kim, Sungkyunkwan University

Taiwan
Eddy Peng, Hermes-Epitek Corp.
Willie Pai, KINIK

United States
Gene Davis, Texas Instruments
Rob Rhoades, X-TrinSiC
 

Program committee

China
Renhe Jia, Anstinc Technology
Yuchun Wang, Anji Microelectronics
Baoguo Zhang, Hebei University of Technology
Lifei Zhang, Tsinghua University
 

Europe
Cathérine Euvrard, CEA-Leti
Eric Jacquinot, Merck KGaA
Cedric Perrot, CEA-Leti
Catharina Rudolph, Fraunhofer IZM-ASSID

Japan
Yasuhisa Sano, Osaka University
Kazumi Sugai, Fujimi Inc
Norikazu Suzuki, Chuo University
Michio Uneda, Kanazawa Institute of Technology

South Korea
Sanha Kim, KAIST
Hyunseop Lee, Dong-A University
Kangchun Lee, Kyonggi University
Sangwoo Lim, Yonsei University

Taiwan
Chih Chen, National Yang Ming Chao Tung University
Chao-Cheng Arthur Chen, NTUST
Ming-shih Tsai, VERSUM Materials
Andy Tuan, Fil Technology

United States
Mark Buehler, Intel
Andrew Carswell, Micron
Don Frye, Entegris
Bradley Wood, Entegris

Organizing committee

Cathérine Euvrard, CEA-Leti
Knut Gottfried, Fraunhofer ENAS
Eric Jacquinot, Merck Performance Materials
Patrick Ong, IMEC
Cedric Perrot, CEA-Leti
Catharina Rudolph, Fraunhofer IZM
Ronald Schnabel, VDE/VDI-GMM
Balan Viorel, CEA-Leti

Topics

Conference Topics

Topics

ICPT 2024 provides the largest forum for academic researchers, industrial practitioners, and engineers from around the world dedicated to the exchange of information on the state-of-the-art in Chemical Mechanical Polishing (CMP) and other planarization technologies. Abstracts of new work are requested and can include the following topics relating to planarization:

•    FEOL CMP
•    BEOL CMP
•    Defects, reliability issues and Post CMP cleaning
•    CMP fundamentals, modeling and simulation
•    Equipment, process control and metrology
•    Emerging and alternative CMP technologies 
•    CMP consumables
•    3D ICs/TSV/packaging applications
•    CMP for MEMS and hybrid applications
•    Substrate polish such as Si, SiC, GaN and Diamond

Venue Kurhaus Wiesbaden, Germany

Kurhaus Wiesbaden

Kurhausplatz 1

65189 Wiesbaden, Germany

Kurhaus Wiesbaden

Kurhausplatz 1

65189 Wiesbaden, Germany

Accomodation

Accommodation

Accomodation

In the download section you will find a map with suggestions for your accommodation and sightseeing options in Wiesbaden. 
You can either book directly with the hotel or use the booking links in the download section.
Please remember to make your hotel reservations in good time.

Our recommendations for your accommodation in Wiesbaden:

Dorint Pallas Wiesbaden (pls. book directly with the hotel)
Oranien Hotel & Residences
Radisson Blu Schwarzer Bock (pls. book directly with the hotel)
Best Western Hotel Wiesbaden

Organizer + Contact

Please contact VDE Conference Services for questions concerning the registation, the paper submission and preparation of your presentations, posters, final papers or the exhibition.


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